: Designing 6- to 16-layer boards with a focus on signal integrity, return paths, and EMI mitigation. Component Selection & Power Integrity
“We had a board that failed radiated emissions three times. By day 3 of this masterclass, I realized our ground vias were spaced too far apart. Fixed it in the next spin—passed EMC on the first try. Worth every penny.” — , Senior Hardware Engineer, Automotive Tier-1 Supplier Advanced Hardware and PCB Design Masterclass 20...
: Implementing the 3W rule (spacing at least 3x trace width) to reduce signal integrity issues. Enrollment Information : Designing 6- to 16-layer boards with a
: Layout optimization for boards with over 10,000 interconnects. Manufacturing & Compliance Generating professional Bill of Materials (BOM) and Gerber files for fabrication. Senior Hardware Engineer