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The is a high‑performance, low‑power System‑on‑Chip (SoC) designed specifically for edge‑AI workloads in industrial, automotive, and consumer‑grade devices. By combining a heterogeneous compute fabric with an on‑die AI‑optimized memory subsystem, the MEYD‑675 delivers up to 2 TOPS/W (tera‑operations per second per watt) while maintaining a compact 12 mm × 12 mm footprint in a 7 nm FinFET process.
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